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3D Integration for VLSI Systems
Bag om 3D Integration for VLSI Systems

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9789814303811
  • Indbinding:
  • Hardback
  • Sideantal:
  • 378
  • Udgivet:
  • 26. september 2011
  • Størrelse:
  • 152x229x0 mm.
  • Vægt:
  • 636 g.
  • 2-3 uger.
  • 11. december 2024

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  • BLACK NOVEMBER

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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Beskrivelse af 3D Integration for VLSI Systems

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC). Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

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