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3D Integration in VLSI Circuits - Bog

- Implementation Technologies and Applications

indgår i Devices, Circuits, and Systems serien

3D Integration in VLSI Circuits
Bag om 3D Integration in VLSI Circuits

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781032095547
  • Indbinding:
  • Paperback
  • Sideantal:
  • 234
  • Udgivet:
  • 30. juni 2021
  • Størrelse:
  • 156x234x0 mm.
  • Vægt:
  • 426 g.
  • 2-4 uger.
  • 24. december 2024
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Forlænget returret til d. 31. januar 2025

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Beskrivelse af 3D Integration in VLSI Circuits

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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