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  • - Transistors and Interconnects at the Nanoscale
    af Inc., California, Santa Clara, mfl.
    812,95 kr.

  • af College Park, Oregon, Indiana, mfl.
    1.917,95 kr.

    Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

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