Name: Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Price: 2470.95 DKK
Availability: InStock
Author: Hengyun (Shanghai University of Engineering Science Zhang
ISBN: 9780081025321

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore af Hengyun (Shanghai University of Engineering Science Zhang

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Paperback
8-11 hverdage
2.470,95 kr.

Sprog:
Engelsk

ISBN:
9780081025321

Forlag:
Elsevier Science & Technology

Indbinding:
Paperback

Sideantal:
434

Udgivet:
15. november 2019

Størrelse:
229x153x30 mm.

Vægt:
698 g.

Leveringstid: 8-11 hverdage.
Forventet levering: 20. november 2024

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