Black November: Store besparelser hele måneden Vi fejrer Black Friday hele november måned med store besparelser
Udvidet returret til d. 31. januar 2025
Hjælp
Login
  1. Forside
  2. Bøger
  3. Business og læring
  4. Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture - E-H Wong - Bog

af E-H Wong

indgår i Woodhead Publishing Series in Electronic and Optical Materials serien

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture af E-H Wong
Bag om Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.

Vis mere
  • Sprog:
  • Engelsk
  • ISBN:
  • 9781845695286
  • Indbinding:
  • Hardback
  • Sideantal:
  • 482
  • Udgivet:
  • 22. maj 2015
  • Størrelse:
  • 152x229x0 mm.
  • Vægt:
  • 830 g.
  • 2-4 uger.
  • 17. december 2024
På lager

Normalpris

  • BLACK NOVEMBER

Medlemspris

Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Bag om E-H Wong

Vis alle bøger af E-H Wong

Beskrivelse af Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.

Brugerbedømmelser af Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture



Andre købte også..
Find lignende bøger
Bogen Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture findes i følgende kategorier:

Gør som tusindvis af andre bogelskere

Tilmeld dig nyhedsbrevet og få gode tilbud og inspiration til din næste læsning.