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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture - E-H Wong - Bog

af E-H Wong

indgår i Woodhead Publishing Series in Electronic and Optical Materials serien

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture af E-H Wong
Bag om Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781845695286
  • Indbinding:
  • Hardback
  • Sideantal:
  • 482
  • Udgivet:
  • 22. Maj 2015
  • Størrelse:
  • 152x229x0 mm.
  • Vægt:
  • 830 g.
  • 2-4 uger.
  • 9. Juli 2024
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Failure of electronic packaging: Effects of temperature, moisture and mechanical driving forces provides a thorough review of this important field of research.

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