Bøger i Elements in Flexible and Large-Area Electronics serien

Provides an account and directional atlas of the progress in materials and devices for electronic skins, in the context of sensing principles and skin-like features. We give an overview of essential electronic circuits and systems used in large-area tactile sensor arrays, and present the challenges facing future developments.

Bioresorbable electronics offer a revolutionary solution to replace the built-to-last electronics used in implanted devices and electronic gadgets. This Element analyzes the unique dissolution behaviors and biological effects of bioresorbable materials such as metals, polymers, inorganic compounds and semiconductors used to construct devices.

With a comprehensive overview of flexible organic and amorphous-metal-oxide analogue electronics, take a fresh look at the evolution and immediate opportunities of the field.

This volumes describes the various approaches for synthesising micro/nanostructures, their integration onto large-area flexible/stretchable substrates, and the creation of high-performance electronic devices from them.

This Element addresses the design of multi-functional touch screen panels (TSPs) with integrated concurrent capture of ubiquitous capacitive touch signals and force information. It compares and contrasts interactive technologies and presents design considerations for multi-dimensional touch screens with high detection sensitivity, accuracy and resolution.

This Element presents an in-depth discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response.

Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.