Bøger af Sujoy Kumar Saha

This Brief stands as a primer for heat transfer fundamentals in heat transfer enhancement devices, the definition of heat transfer area, passive and active enhancement techniques and their potential and benefits and commercial applications.

The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices.

This Brief deals with electrode design and placement, enhancement of both liquid and gas flow, vapor space condensation, in-tube condensation, falling film evaporation, correlations. It further provides a fundamental understanding of boiling and condensation, pool boiling, critical heat flux, convective vaporization, additives for single-phase liquids like solid particles, gas bubbles, suspensions in dilute polymer and surfactant solutions, solid additives and liquid additives for gases, additives for boiling, condensation and absorption, mass transfer resistance in gas phase (condensation with noncondensible gases, evaporation into air, dehumidifying finned tube heat exchangers, water film enhancement of finned tube exchanger), controlling resistance in liquid phase, and significant resistance in both phases. The volume is ideal for professionals and researchers dealing with thermal management in devices.

This Brief concerns heat transfer and pressure drop in heat transfer enhancement for boiling and condensation. The authors divide their topic into six areas: abrasive treatment and coatings, combined structured and porous surfaces, basic principles of boiling mechanism, vapor space condensation, convective vaporization, and forced condensation inside tubes. Within this framework, the book examines range of specific phenomena including abrasive treatment, open grooves, 3D cavities, etched surfaces, electroplating, pierced 3D cover sheets, attached wire and screen promoters, non-wetting coatings, oxide and ceramic coatings, porous surfaces, structured surfaces (integral roughness), combined structured and porous surfaces, composite surfaces, single-tube pool boiling tests, theoretical fundamentals like liquid superheat, effect of cavity shape and contact angle on superheat, entrapment of vapor in cavities, nucleation at a surface cavity, effect of dissolved gases, bubble departure diameter, bubble dynamics, boiling hysteresis and orientation effects, basic principles of boiling mechanism, visualization and mechanism of boiling in subsurface tunnels, and Chien and Webb parametric boiling studies.

This Brief deals with externally finned tubes, their geometric parameters, Reynolds number, dimensionless variables, friction factor, plain plate fins on round tubes, the effect of fin spacing, correlations, pain individually finned tubes, circular fins with staggered tubes, low integral fin tubes, wavy fin, enhanced plate  fin geometries with round tubes, Offset Strip Fins, convex louver fins, louvered fin, perforated fin, mesh fin, vortex generator, enhanced circular fin geometries, spine or segmented fin, wire loop fin, flat extruded tubes with internal membranes, plate and fin automotive radiators, performance comparison, numerical simulation, advanced fin geometries, hydrophilic coatings, internally finned tubes and annuli, spirally fluted and  indented tube, advanced internal fin geometries, and finned annuli. The book is ideal for professionals and researchers dealing with thermal management in devices.

This Brief concerns the important problem of critical heat flux in flow boiling in microchannels.

This Brief addresses the phenomena of instability in flow boiling in microchannels occurring in high heat flux electronic cooling. A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to ΓÇ£Critical Heat Flux in Flow Boiling in Microchannels,ΓÇ¥ and "Heat Transfer and Pressure Drop in Flow Boiling in Microchannels,"by the same author team, this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

A companion edition in the SpringerBrief Subseries on Thermal Engineering and Applied Science to three other monographs including "Critical Heat Flux in Flow Boiling in Microchannels," this volume is idea for professionals, researchers, and graduate students concerned with electronic cooling.

This Brief addresses the phenomena of heat transfer and pressure drop in flow boiling in micro channels occurring in high heat flux electronic cooling.