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Advanced Materials for Thermal Management of Electronic Packaging - Xingcun Colin Tong - Bog

af Xingcun Colin Tong

indgår i Springer Series in Advanced Microelectronics serien

Advanced Materials for Thermal Management of Electronic Packaging af Xingcun Colin Tong
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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781441977588
  • Indbinding:
  • Hardback
  • Sideantal:
  • 618
  • Udgivet:
  • 10. januar 2011
  • Størrelse:
  • 159x242x53 mm.
  • Vægt:
  • 1102 g.
  • 8-11 hverdage.
  • 9. december 2024
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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.

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