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Foldable Flex and Thinned Silicon Multichip Packaging Technology - Bog

indgår i Emerging Technology in Advanced Packaging serien

Foldable Flex and Thinned Silicon Multichip Packaging Technology
Bag om Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780792376767
  • Indbinding:
  • Hardback
  • Sideantal:
  • 347
  • Udgivet:
  • 31. januar 2003
  • Udgave:
  • 2003
  • Størrelse:
  • 235x155x22 mm.
  • Vægt:
  • 1550 g.
  • 8-11 hverdage.
  • 22. januar 2025

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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Beskrivelse af Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

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