Bøger af Eugene R. (Encinitas Hnatek

Examines various aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This work discusses: circuit design technology trends; sources of error in wafer fabrication and assembly; avenues of contamination; IC packaging methods; and, in-line process monitors and test structures.

Examining examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. It focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, and printed wiring assembly.