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Plasma enhanced chemical vapor deposition (PECVD) is a technique widely accepted in microelectronics for the deposition of amorphous dielectric films such as silicon nitride and silicon oxide. Batch etching reactors and etching processes are approaching ma turity after more than ten years of development.
The UNIX and real-time UNIX operating system technologies are major examples of emerging technologies with great potential benefits but unrealistic expectations. General-purpose UNIX will exist only as a subset of real-time UNIX.
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