Bøger af Mohammad Tariqul Islam

This book presents peer-reviewed articles from the 8th International Conference on Space Science and Communication (IConSpace 2023), held at Penang in Malaysia. It addresses complications of ground-breaking initiatives and solutions for space science and communications research, telecommunications, and meteorology. With the theme Advanced Space Technology: Accelerating Global Agenda will provide valid information to understand trends, evaluate needs, and create global development policies and programs in the best interest of all. It brings together researchers, engineers, geospatialist, meteorologists, astronomers, and practitioners in order to present the latest applications in space science, telecommunications, meteorology, remote sensing, and related fields.

This book discusses the role of optical networks in 3G, 4G, 5G and beyond. The authors discuss the evolution of the technologies, the research involved, and the applications with respect to optical communication systems. In addition, the book provides in-depth knowledge of broadband connectivity for future generation networks. More focus is given towards the front-, mid- and back- hauling of 5G and beyond. The authors present architecture for broadband connectivity and explain its potential in 5G and beyond applications. This book includes several architectures based on Hybrid Fiber-Wireless; Next Generation Passive Optical Networks Stage 1 and 2; millimeter wave over fiber; sub-THz wave over fiber; millimeter/sub-THz wave over multicore fiber; 6G fronthaul; 6G backhaul; GMPLS networks, and massive MIMO sub-Thz antenna. The contributors provide supplementary material such as simulations, analysis and experiments.

Antenna in fourth generation(4G) is said to be not sufficient for the new generation of mobile communication ¿ fifth generation(5G). With the continuous progress of wireless communication, devices becoming compact day by day. A compact antenna need to be develop to meet the requirements of 5G which enable a higher capacity, more connectivity, higher reliability and larger application. Some key factors such as lightweight, ease of fabrication, low cost, low profile and robust must be taken into account.