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Wafer-Level Chip-Scale Packaging

- Analog and Power Semiconductor Applications

af Shichun Qu & Yong Liu

1.373,95 - 1.978,95 kr.

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
- Bog
- 1.373,95 kr.
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