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Heat Management in Integrated Circuits - Northwestern University - Bog

- On-chip and system-level monitoring and cooling

af Northwestern University, USA) Ogrenci-Memik, Seda (Associate Professor, Electrical Engineering and Computer Science Department

indgår i Materials, Circuits and Devices serien

Heat Management in Integrated Circuits af Northwestern University
Bag om Heat Management in Integrated Circuits

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781849199346
  • Indbinding:
  • Hardback
  • Sideantal:
  • 264
  • Udgivet:
  • 1. december 2015
  • Størrelse:
  • 165x245x20 mm.
  • Vægt:
  • 564 g.
  • 8-11 hverdage.
  • 17. januar 2025
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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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Beskrivelse af Heat Management in Integrated Circuits

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

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