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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Dean L. Monthei - Bog

af Dean L. Monthei

indgår i Electronic Packaging and Interconnects serien

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications af Dean L. Monthei
Bag om Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780792383642
  • Indbinding:
  • Hardback
  • Sideantal:
  • 234
  • Udgivet:
  • 1. november 1998
  • Udgave:
  • 1999
  • Størrelse:
  • 234x156x15 mm.
  • Vægt:
  • 1170 g.
  • 8-11 hverdage.
  • 22. januar 2025

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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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Beskrivelse af Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

Brugerbedømmelser af Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications



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