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SemiConductor Wafer Bonding - Q.-Y. (Duke University Tong - Bog

- Science and Technology

af Q.-Y. (Duke University Tong, U. (Max-Planck-Institute of Microstructure Physics Goesele

indgår i The ECS Series of Texts and Monographs serien

SemiConductor Wafer Bonding af Q.-Y. (Duke University Tong
Bag om SemiConductor Wafer Bonding

Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780471574811
  • Indbinding:
  • Hardback
  • Sideantal:
  • 320
  • Udgivet:
  • 18. December 1998
  • Størrelse:
  • 164x246x20 mm.
  • Vægt:
  • 517 g.
  • 8-11 hverdage.
  • 19. Oktober 2024

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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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Beskrivelse af SemiConductor Wafer Bonding

Though there has been a lot of scattered information on specific aspects of wafer bonding--a technique for welding semiconductor wafers together without using glue, this is one of the first practical works to bring together a broad range of information into a coherent overview of the field.

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