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  4. Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages - Gerard Kelly - Bog

af Gerard Kelly
Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages af Gerard Kelly
Bag om Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780792384854
  • Indbinding:
  • Hardback
  • Sideantal:
  • 134
  • Udgivet:
  • 30. april 1999
  • Udgave:
  • 1999
  • Størrelse:
  • 244x170x11 mm.
  • Vægt:
  • 910 g.
  • 8-11 hverdage.
  • 7. december 2024

Normalpris

  • BLACK NOVEMBER

Medlemspris

Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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Beskrivelse af Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.

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