Name: Solder Joint Reliability
Price: 2778.95 DKK
Availability: InStock
Author: John H. Lau
ISBN: 9780442002602

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Hardback
8-11 hverdage
2.778,95 kr.

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New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

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Sprog:
Engelsk

ISBN:
9780442002602

Forlag:
Van Nostrand Reinhold Inc.,U.S.

Indbinding:
Hardback

Sideantal:
631

Udgivet:
31. maj 1991

Udgave:
1991

Størrelse:
234x156x34 mm.

Vægt:
2400 g.

Leveringstid: 8-11 hverdage.
Forventet levering: 10. december 2024

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New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

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Business og læring > Computer og IT

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