Name: Solder Joint Reliability
Price: 2777.95 DKK
Availability: InStock
Author: John H. Lau
ISBN: 9781461367437

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2.777,95 kr.

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New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

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Sprog:
Engelsk

ISBN:
9781461367437

Forlag:
Springer-Verlag New York Inc.

Indbinding:
Paperback

Sideantal:
631

Udgivet:
23. februar 2014

Udgave:
11991

Størrelse:
235x155x34 mm.

Vægt:
991 g.

Leveringstid: 8-11 hverdage.
Forventet levering: 6. december 2024

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New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.

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Business og læring > Computer og IT

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