Name: Solder Paste in Electronics Packaging
Price: 1141.95 DKK
Availability: InStock
Author: Jennie Hwang
ISBN: 9780442013530

Solder Paste in Electronics Packaging af Jennie Hwang

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Paperback
8-11 hverdage
1.141,95 kr.

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.

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Sprog:
Engelsk

ISBN:
9780442013530

Forlag:
Van Nostrand Reinhold Inc.,U.S.

Indbinding:
Paperback

Sideantal:
456

Udgivet:
24. september 1992

Udgave:

Størrelse:
229x152x24 mm.

Vægt:
703 g.

Leveringstid: 8-11 hverdage.
Forventet levering: 16. januar 2025

Forlænget returret til d. 31. januar 2025

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1.091,95 kr.

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.

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