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System-in-Package - Lei He - Bog

- Electrical and Layout Perspectives

af Lei He, Wei Yao, Shauki Elassaad, Yiyu Shi, Yu Hu

indgår i Foundations and Trends (R) in Electronic Design Automation serien

System-in-Package af Lei He
Bag om System-in-Package

Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781601984586
  • Indbinding:
  • Paperback
  • Sideantal:
  • 94
  • Udgivet:
  • 30. Juni 2011
  • Størrelse:
  • 234x156x5 mm.
  • Vægt:
  • 146 g.
  • 2-3 uger.
  • 24. Juli 2024

Normalpris

Medlemspris

Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Bag om Lei He

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Beskrivelse af System-in-Package

Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.

Brugerbedømmelser af System-in-Package



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