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Wafer Level 3-D ICs Process Technology - Bog

indgår i Integrated Circuits and Systems serien

Wafer Level 3-D ICs Process Technology
Bag om Wafer Level 3-D ICs Process Technology

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780387765327
  • Indbinding:
  • Hardback
  • Sideantal:
  • 410
  • Udgivet:
  • 1. august 2008
  • Udgave:
  • 2009
  • Størrelse:
  • 241x166x23 mm.
  • Vægt:
  • 656 g.
  • 8-11 hverdage.
  • 16. januar 2025

Normalpris

Medlemspris

Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Beskrivelse af Wafer Level 3-D ICs Process Technology

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.

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