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1.430,95 kr.

Bag om 3D Microelectronic Packaging

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

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Sprog:
Engelsk

ISBN:
9789811570926

Forlag:
Springer Verlag, Singapore

Indbinding:
Paperback

Sideantal:
622

Udgivet:
24. November 2021

Udgave:
22021

Størrelse:
155x235x0 mm.

Vægt:
967 g.

Leveringstid: 2-3 uger.
Forventet levering: 16. Juli 2024

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

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