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Bag om 3D Microelectronic Packaging

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

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Sprog:
Engelsk

ISBN:
9783319830865

Forlag:
Springer International Publishing AG

Indbinding:
Paperback

Sideantal:
463

Udgivet:
13. Juli 2018

Udgave:
12017

Størrelse:
155x235x0 mm.

Vægt:
724 g.

Leveringstid: 2-3 uger.
Forventet levering: 23. Juli 2024

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.

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