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  4. ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020) - American Society of Mechanical Engineers - Bog

af American Society of Mechanical Engineers
ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)af American Society of Mechanical Engineers
Bag om ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780791884041
  • Indbinding:
  • Paperback
  • Sideantal:
  • 566
  • Udgivet:
  • 31. Juli 2024
  • Størrelse:
  • 213x276x0 mm.
  • Vægt:
  • 800 g.
  • Ukendt - mangler pt..

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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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Beskrivelse af ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)

Presents 65 papers from the 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems featuring subjects such as Servers of the Future, Edge, and Cloud Computing, Autonomous, Hybrid and Electric Vehicles, and Power Electronics.

Brugerbedømmelser af ASME 2020 Proceedings of the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2020)



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