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  4. Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic Components

Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic Components - Sachin Sapatnekar - Bog

af Sachin Sapatnekar
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic Components af Sachin Sapatnekar
Bag om Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-Informed Design of Microelectronic Components

The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a compr...

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9789814583435
  • Indbinding:
  • Hardback
  • Sideantal:
  • 212
  • Udgivet:
  • 18. December 2014
  • Størrelse:
  • 170x13x244 mm.
  • Vægt:
  • 540 g.
  • 2-3 uger.
  • 22. Maj 2024
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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order "compact" thermal models of electronic components, a database of critical material thermal properties, and a compr...

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