Name: Fan-Out Wafer-Level Packaging
Price: 915.95 DKK
Availability: InStock
Author: John H. Lau
ISBN: 9789811342660

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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

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Beskrivelse af Fan-Out Wafer-Level Packaging

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.

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