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Hybrid Assemblies and Multichip Modules - Fred W. Kear - Bog

Bag om Hybrid Assemblies and Multichip Modules

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780824784669
  • Indbinding:
  • Hardback
  • Sideantal:
  • 296
  • Udgivet:
  • 16. december 1992
  • Størrelse:
  • 156x234x17 mm.
  • Vægt:
  • 635 g.
  • 8-11 hverdage.
  • 7. december 2024

Normalpris

  • BLACK NOVEMBER

Medlemspris

Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Beskrivelse af Hybrid Assemblies and Multichip Modules

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

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