Name: Hybrid Assemblies and Multichip Modules
Price: 2445.95 DKK
Availability: InStock
Author: Fred W. Kear
ISBN: 9780824784669

Hybrid Assemblies and Multichip Modules af Fred W. Kear

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2.445,95 kr.

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Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

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Sprog:
Engelsk

ISBN:
9780824784669

Forlag:
Taylor & Francis Inc

Indbinding:
Hardback

Sideantal:
296

Udgivet:
16. december 1992

Størrelse:
156x234x17 mm.

Vægt:
635 g.

Leveringstid: 8-11 hverdage.
Forventet levering: 20. november 2024

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Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

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