Name: Modeling and Application of Flexible Electronics Packaging
Price: 1111.95 DKK
Availability: InStock
Author: Yongan Huang
ISBN: 9789811336263

Modeling and Application of Flexible Electronics Packaging af Yongan Huang

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process.

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Sprog:
Engelsk

ISBN:
9789811336263

Forlag:
Springer Verlag, Singapore

Indbinding:
Hardback

Sideantal:
287

Udgivet:
7. maj 2019

Udgave:
12019

Vægt:
629 g.

Leveringstid: 8-11 hverdage.
Forventet levering: 7. december 2024

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This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process.

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Business og læring > Computer og IT

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