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Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modelling and Equipment - Bog

Bag om Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modelling and Equipment

Includes papers that cover the E-MRS conference on Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modeling and Equipment. This book covers a wide range of subjects, financial issues, fab concepts, crystal growth, wafer process development, material and defect issues, and wafer characterization.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780080436098
  • Indbinding:
  • Hardback
  • Sideantal:
  • 206
  • Udgivet:
  • 8. september 1999
  • Størrelse:
  • 210x279x0 mm.
  • Vægt:
  • 670 g.
  • 2-4 uger.
  • 1. februar 2025
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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Beskrivelse af Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modelling and Equipment

Includes papers that cover the E-MRS conference on Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modeling and Equipment. This book covers a wide range of subjects, financial issues, fab concepts, crystal growth, wafer process development, material and defect issues, and wafer characterization.

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