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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Juan Cepeda-Rizo - Bog

af Juan Cepeda-Rizo

indgår i Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems serien

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments af Juan Cepeda-Rizo
Bag om Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781032160818
  • Indbinding:
  • Hardback
  • Sideantal:
  • 290
  • Udgivet:
  • 30. December 2021
  • Størrelse:
  • 243x224x24 mm.
  • Vægt:
  • 592 g.
  • 2-3 uger.
  • 16. Juli 2024
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Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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