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Three-Dimensional Molded Interconnect Devices (3D-MID) - Jorg Franke - Bog

- Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

af Jorg Franke
Three-Dimensional Molded Interconnect Devices (3D-MID) af Jorg Franke
Bag om Three-Dimensional Molded Interconnect Devices (3D-MID)

Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9781569905517
  • Indbinding:
  • Hardback
  • Sideantal:
  • 356
  • Udgivet:
  • 30. April 2014
  • Størrelse:
  • 174x246x25 mm.
  • Vægt:
  • 1001 g.
  • 8-11 hverdage.
  • 20. Juli 2024

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Medlemspris

Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

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Beskrivelse af Three-Dimensional Molded Interconnect Devices (3D-MID)

Offers a comprehensive insight into the state of the art in 3D- molded interconnect device (MID) technology along the entire process chain. Individual chapters deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

Brugerbedømmelser af Three-Dimensional Molded Interconnect Devices (3D-MID)



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