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Through Silicon Vias - Brajesh Kumar Kaushik - Bog

- Materials, Models, Design, and Performance

Bag om Through Silicon Vias

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

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  • Sprog:
  • Engelsk
  • ISBN:
  • 9780367574543
  • Indbinding:
  • Paperback
  • Sideantal:
  • 216
  • Udgivet:
  • 30. juni 2020
  • Størrelse:
  • 156x234x0 mm.
  • Vægt:
  • 430 g.
  • 2-4 uger.
  • 27. november 2024
På lager

Normalpris

  • BLACK NOVEMBER

Medlemspris

Prøv i 30 dage for 45 kr.
Herefter fra 79 kr./md. Ingen binding.

Beskrivelse af Through Silicon Vias

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

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