The Art and Science of Microsystem Packaging - Leland Spangler - Bog

Covering the challenges faced by design engineers in microsystems packaging, this book details the variety of materials that can be used as well as the advantages and disadvantages of each. It places emphasis on materials, technologies, and assembly processes and guidelines that are being used in production and are production worthy. The reader is assumed to have general understanding of micromachined concepts and semiconductor fabrication technology.